| 摘要 |
PURPOSE:To resin-mold a semiconductor chip thin by placing the resin mold member in which a thin-film resin is formed on the surface of a base consisting of resin, on a semiconductor chip on the circuit board on which wiring has been completed and fusing that member. CONSTITUTION:After completing the electrical wiring of a semiconductor chip 3 mounted on a circuit board 1, a resin mold member 12 is placed in a resin mold part. In this resin mold member 12, a high-melting-point thin-film resin 12b is formed on a base 12a consisting of resin so as to cover the surface of the mold resin with the high-melting-point thin-film resin 12b when the base 12a of the resin mold member 12 fuses. Thus, for fabricating semiconductor devices, the resin mold member 12 composed of the base 12a consisting of resin and the high-melting-point thin-film resin 12b formed on said base 12a is used. |
