SEMICONDUCTOR LASER DEVICE

摘要

PURPOSE:To perform bonding accurately without angle misalignment and to suppress heat resistance to a small value, by bonding a semiconductor laser chip to a silicon submount so that the light emitting surface and one side surface of the semiconductor laser chip are aligned with the neighboring two side surfaces of the silicon submount at the same plane. CONSTITUTION:A copper stem 3 has a step part, which is slightly lower than the thickness of a silicon submount 2 on the bonding stage of the stem 3. A semiconductor laser chip 1 is bonded to the silicon submount. The chip is placed at the corner in front of the step part of the copper stem. The front surface and the side surface on the step side of the chip are aligned with the side surfaces of the submount. The submount is bonded to the copper stem. The size of the copper stem 3 is desingd so that the light emitting part of the semiconductor laser chip 1 is automatically located at the center of the copper stem 3 when the bonded semiconductor laser chip 1 and the silicon submount 2 are bonded.