| 摘要 |
<p>PURPOSE:To enhance the density of high speed signal terminals and the reliability of terminal connections by using filmlike leads having an impedance equal to the characteristic impedance of a circuit board for a wiring route between semiconductor chips and between the chip and the board. CONSTITUTION:One or more semiconductor chips 6 are placed and contained in a case 7 having a cover 7', and the case 7 is placed on a circuit board 8. The chips 6 in the case 7 of such a semiconductor package, and the chips 6 and the board 8 are connected therebetween by filmlike leads 2 having connecting wiring pattern equalized in the impedance, and the leads 2 are interposed fixedly between the case 7 and the cover 7'. The leads 2 and the input/ output terminals of the chips 6 are secured and connected in the case 7, and the wiring pattern of the board 8 and the wiring pattern on the leads are secured and connected out of the case 7.</p> |
