| 摘要 |
PURPOSE:To prevent a semiconductor device from damaging due to an overcurrent and to improve the reliability of a semiconductor element made of a plurality of circuit elements by effectively securing the semiconductor element under uniform pressure force, thereby increasing the size. CONSTITUTION:The first electrodes 22a, 22b are mounted through an insulator 21 on the prescribed region on a case 20, and a plurality of semiconductor elements 23a, 23b are placed at the prescribed regions of the insulator 21 connected with the electrodes 22a, 22b. The second electrodes 25a, 25b and elastic members 27a, 27b are sequentially laminated on the elements 23a, 23b. Further, clamping members 29a, 29b screwed at one ends with the case 20 to contact the elements 23a, 23b through the members 27a, 27b and the electrodes 25a, 25b under pressure, and means for displaying the clamping degrees of the members 29a, 29b are provided. The members 27a, 27b use, for example, leaf springs, and the members 29a, 29b use bolts. The means uses, for example, marks 33 to be visually confirmed on the bolts 29a, 29b or utilize the rotating speeds of the bolts 29a, 29b. |
