发明名称 |
FORMATION OF METAL-SINTERED LAYER ONTO SURFACE OF METALLIC BASE MATERIAL |
摘要 |
PURPOSE:To prevent the exfoliation of a tape-shaped metallic powder molding and to form a metal-sintered layer having a smooth surface by winding and fixing the metallic powder molding onto the surface of a metallic member by superposing partly the molding via an adhesive fixing material. CONSTITUTION:A tapered face 11a is formed to one surface side at one end 1a of the tape-shaped metallic powder molding. a length of the adhesive fixing material 2 is provided to the other end 1b and a tapered face 12b is formed onto the other surface side thereof. Such metallic powder molding 1 is wound and fixed onto the surface of the metallic base material 3 in a manner as to have overlap parts 10 by bringing the one surface 11 side of the molding to the inside. The member is then sintered in a non-oxidative atmosphere The material 2 induces the condensation polymn. reaction by thermal decomposition during sintering and is converted to a carbon precursor. Said precursor exhibits the function to assist the adhesive fixing of the molding 1 onto the material 3 surface in the temp. range up to about 700 deg.C at which the molding 1 begins to sinter.
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申请公布号 |
JPS61284506(A) |
申请公布日期 |
1986.12.15 |
申请号 |
JP19850126872 |
申请日期 |
1985.06.10 |
申请人 |
NITTO ELECTRIC IND CO LTD |
发明人 |
SAKURAMOTO TAKAFUMI;TOMINAGA TAKASHI;KAMEI KIYOHIRO;KOBAYASHI YOSHIKI |
分类号 |
B22F3/02;B22F5/12;B22F7/04 |
主分类号 |
B22F3/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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