| 摘要 |
PURPOSE:To obtain the operation margin of an internal circuit, to stabilize the operation and to enhance the mass productivity by bonding the pads of conductor wirings and a chip provided on the periphery of an island of a lead frame and the pads of a leading chip from the island. CONSTITUTION:Electrically insulated conductor wirings 42 are provided on the periphery of an island 41 secured onto an insulating plate 45 made of ceramics. A plurality of terminals 1 40 of a lead frame are arranged around the wirings. A bipolar semiconductor chip 46 made of a P-type semiconductor substrate is mounted on the island 41. 10 pieces of pads 47 connected with a VEE power source of the lowest potential are disposed in the chip 46. 8 pads 48 connected with a VCC power source of the highest potential are disposed in the chip 46. Further, 38 pads 49 of input/output terminals for signals are disposed in the chip 46. Each piece of 56 pads is electrically connected with the terminals of the lead frame by bonding wiring 50. |
