| 摘要 |
PURPOSE:To prevent the generation of blob- and icicle-shaped solder flashes to the lower part of a lead frame in the case of immersing the lead frame into a solder tank and subjecting the same to solder plating by pulling up the lead frame in an inclined posture from the solder tank. CONSTITUTION:Both ends of the lead frame 5 are clamped by clamps 4 and the lead frame is immersed into a solder bath 6 at the equal descending speed of cylinders 2a, 2b in the stage of subjecting the lead frame to solder plating. The ascending speed of the cylinder 2a is thereafter so controlled as to be made slightly higher than the ascending speed of the cylinder 2b so that said cylinder is slowly raised. The lead frame 5 successively ascends in the diagonal state toward the upper right side and the solder trying to remain in the lower part of the frame 5 flows toward the lower left along the bottom surface of the frame 5 and is recovered into the solder bath 6. The solder plating having a uniform thickness is thereby formed over the entire part of the lead frame at the point of the time when the pull up is completed.
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