| 摘要 |
PURPOSE:To obtain a semiconductor memory package device with high quality and reliability inexpensively by composing an ultraviolet ray transmitting window in a light transmitting enclosure for forming a hollow portion without contacting a memory array. CONSTITUTION:A cup-shaped light transmission enclosure 12 disposed fixedly by a bonding material 13 on the upper surface of an EPROM chip 1 is exposed on the exterior of a synthetic resin case 7 at the upper surface side, bonded at the hole side at the position not contacted with the memory array at least on the surface of the chip 1, and a hollow portion 3 is formed in the upper portion of the array. Accordingly, the decrease in the reliability due to the compression or contamination from the exterior can be suppressed to improve the memory retentivity and wet resistance property. The enclosure 12 is formed in a cup shape formed with a hollow portion 13 therein. Thus, the ultraviolet ray transmitting glass material of relatively high cost can be reduced as compared with the light transmitting material having no hollow portion 3 to reduce the cost. |
