发明名称 PLATING DEVICE FOR TERMINAL OF PRINTED CIRCUIT BOARD
摘要 PURPOSE:To suppress the generation of the variance in plating thickness and to approximate the same to an average thickness by controlling discretely currents to divided anodes in the stage of arranging the plural divided anodes, passing the terminals of a printed circuit board therebetween and injecting a plating liquid thereto. CONSTITUTION:The plural divided anodes 5 are connected to respectively discrete power feed circuits 12 and are made independent. The printed circuit board 1 having the terminals 2 is moved toward an arrow along a moving line A and the plating liquid 6 is ejected from plural nozzles 9 for each of block areas 10 so that each of the terminals 2 positioned in the corresponding positions is subjected to a plating treatment. A current detector 16 detects constantly the current flowing to the circuits 12 and changes over a change-over switch 15 to a resistance circuit 14 side when the current flowing therein attains a set value or above. The switch 15 is again connected to the circuits 14 by a timer 15 upon lapse of the set time. The terminals are plated to the uniform thickness by controlling discretely the plating treatment in the above-mentioned manner.
申请公布号 JPS61281894(A) 申请公布日期 1986.12.12
申请号 JP19850123505 申请日期 1985.06.08
申请人 ELECTROPLATING ENG OF JAPAN CO 发明人 TEZUKA JUNICHI
分类号 C25D7/00;C25D17/00;C25D17/12;C25D21/00;H05K3/24 主分类号 C25D7/00
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