| 摘要 |
PURPOSE:To apply securely a wire-bonding to the substrate having a flexibility and to contrive to improve the reliability of a semiconductor device by a method wherein a ball-bonding is performed on the semiconductor chip, subsequently the wire is guided onto the substrate and the wire is cut by performing a stitch- bonding and a ball-bonding is applied to the same place as the stitch-bonded place. CONSTITUTION:A ball-shaped fused metal slug 13 is pressingly adhered on a bonding pad 3 on a semiconductor chip 2 while being given ultrasonic vibrations from a capillary 1 and after a ball-bonding 4 is performed, a wire 5 is guided onto a lead terminal 7 on an FPC 9 and the wire 5 is cut by performing a stitch-bonding. After that, a fused metal slug 13 is further formed on the point of the capillary 1, that slug 13 is pressingly adhered on the same place as the stitch-bonded place on the lead terminal 7 and after a ball-bonding 14 is performed, the capillary 1 is raised. Subsequently the capillary 1 is droopingly pressure-welded on the ball-bonding part 14 on the lead terminal 7 in a state that the wire 5 goes being housed in the capillary 1 and the wire 5 is cut by performing a stitch-bonding. |
