ELETRICALLY CONDUCTIVE COMPOSITION

摘要

PURPOSE:To achieve a heat-resistant bonding in high adhesivity, by compounding a low-expansion glass and electrically conductive fine powder at a ratio within a specific range. CONSTITUTION:An electrically conductive composition can be produced by compounding 1-70wt% low-expansion glass composition with 99-30% electrically conductive fine powder. The low-expansion glass is preferably the one having an expansion coefficient of about 10-50X10<-7>/ deg.C and a softening point of about <=700 deg.C. The electrically conductive fine powder is e.g. Cu powder. The electrically conductive composition enables the mounting of an external lead to a semiconductor element having a low-expansion ceramic insulation layer as a substrate without causing the cracking of the substrate because of sufficiently high electrical conductivity and low expansion coefficient. Accordingly, a reliable and firm bonding can be carried out without using a soldering material.