| 摘要 |
PURPOSE:To reduce the cost of a semiconductor product by a method wherein a circuit wiring is fused onto insulating glass coated with a metal case for the elimination of the need for an insulating substrate. CONSTITUTION:The metal case 1' of a semiconductor device of this design and a lead 2' to serve as an external terminal are fused together by using insulating glass 3'. The entirety of the case is plated with a metal and is further plated with Au. To the case, a semiconductor element 7 and passivation element 9' are bonded with Au pieces, epoxy resin, solder, or the like. Connection is established as necessary by a metal fine lead 8'. Employment of a case of this design for a semiconductor device eliminates the need for the construction of a circuit by using such an insulating material as alumina and the like. The number of processes and parts required for building is also reduced.
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