| 摘要 |
PURPOSE:To improve the adhesion of an Ag layer formed by plating on the surface of a Cu alloy by successively forming a Cu layer by striking and a Cu layer by plating on the surface of the Cu alloy before the surface of the Cu alloy is plated with Ag. CONSTITUTION:The surface of a Cu alloy is degreased as usual, roughened and activated by etching with an acid. A Cu layer is then formed by striking on the surface of the Cu alloy, a Cu layer is further formed by conventional plating, and Ag plating is carried out on the resulting underlayer to form an Ag layer. The adhesion between the Cu alloy as the base and the underlayer and between the underlayer and the Ag layer is improved, so the Ag layer is not stripped off.
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