| 摘要 |
PURPOSE:To obtain an electroless Au plating soln. having a high plating rate and superior stability by dissolving KAu(CN)2 as an Au ion source and specified amounts of KOH, KCN and KBH4 in water. CONSTITUTION:A soln. contg. KAu(CN)2 as an Au ion source, 0.1-0.4mol KOH, 0.05-0.15mol KCN and 0.1-0.2mol KBH4 as a pH adjusting agent, a reducing agent, etc. is used as an electroless Au plating soln. A body to be plated is hung on a soluble base metal and immersed in the electroless Au plating soln. at 70 deg.C, and thick Au plating is formed by electroless plating at >=10mum/hr rate. |
