发明名称 ATTACHMENT FOR DIE POLISHING DEVICE
摘要 PURPOSE:To make it possible to polish horizontal surfaces and vary the amplitude of abrasives by converting the rotary motion of the main spindle of a die polishing device by means of an eccentric disk and a cam mechanism. CONSTITUTION:The upper end of a power shaft 2 is connected to the main spindle of a die polishing device. The lower end forming a square shaft if fitted to a disk 16 with a square groove. The disk 16 with the square groove is provided eccentrically in relation to the power shaft 2 and performs eccentric rotary motion. this rotary motion is transferred to a Y axis slide table 6 causing it to perform circular motion around an axis 2a and, in addition, reciprocates an X axis slide table 7 along an X axis direction binding shaft 9. A grindstone holder 12 having a grindstone 11 at the end is is fitted to the lower end of the X axis slide table 7. The eccentricity amount of the disk 16 with the square groove is adjusted by an amplitude adjusting screw 3.
申请公布号 JPS61279458(A) 申请公布日期 1986.12.10
申请号 JP19850120424 申请日期 1985.06.05
申请人 HITACHI LTD 发明人 IWATANI SHIGEHARU
分类号 B24B7/02;B29C45/37 主分类号 B24B7/02
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