| 摘要 |
PURPOSE:To obtain a resin composition effective to treatments for a moisture proofing and the insulation of a hybrid IC and a packaging circuit plate by incorporating a cross-linkable monomer, a photopolymerization initiator and a compd. obtd. by reacting and end-hydroxypolybutadiene, an end- hydroxyhydrogenatd polybutadiene and a maleic anhydride to the resin composition. CONSTITUTION:The titled resin composition is composed of the compd. A obtd. by reacting the end-hydroxypolybutadiene having a weight average molecular weight of 300-10,000, and the end-hydroxyhydrogenated polybutadiene having the weight average molecular weight of 300-10,000, and a degree of hydrogenation of >=90%, and the maleic anhydride, the cross-linkable monomer B and the photopolymerization initiator C. The compounding ratio of the components A, B and C is 40-90 pts.wt. the component A, 10-60 pts.wt. the component B and 0.01-10 pts.wt. the component C. The total amount of the components A and B is 100 pts.wt. The titled resin component is obtd. by compounding each components A, B and C in the prescribed compounding ratio and by dissolving it, while agitating. |
