| 摘要 |
<p>PURPOSE:To form a plated film with high adhesive strength by subjecting TiN to electroless plating using a soln. prepared by dissolving PdCl2 in hydrofluoric acid and hydrochloric acid as an activating soln. CONSTITUTION:>=0.01g PdCl2 is dissolved in a hydrofluoric acid soln. having 0.01-10% concn., and hydrofluoric acid is added up to 0.01-20% hydrofluoric acid concn. to prepare an activating soln. A metallic substrate coated with TiN by an ionic plating method is electrolytically reduced as a cathode in a hydrochloric acid soln. at 1-10A/dm<2> current density for 1-5min, and it is washed in water. The resulting plated substrate is activated by immersion in said activating soln. for about 1min.</p> |
