| 摘要 |
PURPOSE:To avoid adverse effect of the application of marks on the surface of a semiconductor chip, by applying marks identifying good and bad parts on the back surface of the chip, on which a pattern is not formed. CONSTITUTION:A probe is contacted with each semiconductor chip and electric characteristics are inspected. Thus good or bad parts are judged. Based on the judged data, by applying ink and the like on the back surface, on which a pattern is not formed, identifying marks 17 are indicated. As a result, when errors in judgment of the good or bad parts are found later, only the back surface is washed and the marks are removed.
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