| 摘要 |
PURPOSE:To finely bond an insulating pin to a substrate and sealing resin by a method wherein, when sealing resin is formed, the head of insulating member with uneven sections is inserted into a through-hole in a substrate to bring the bottom of insulating member into contact with the surface of a metal die. CONSTITUTION:A counter-sink through-hole 7 is made in a substrate 2. Next the head 82 of an insulating pin 8 is inserted into the through-hole 7 and the bottom 81 of pin 8 is brought into contact with the surface of a metal die 4 with the surface of substrate 2 held back by another pin 6. When a cavity in the metal die 4 is filled with resin in such a state, the insulating pin can be bonded to substrate 2 and a resin layer encircling the substrate 2 by the resin filling the cavity subject to variation in cross-section of the pin 8 and the through-hole 7.
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