| 摘要 |
<p>PURPOSE:To simplify sealing processes, by mounting a box body, which is formed as a unitary body by a sealing resin material part and a frame part for preventing the flow out of the resin material, in an area to be sealed, and fusing, depositing and hardening the sealing resin material. CONSTITUTION:A frame part 5 for preventing the flow out of resin is made to be a side surface. A sealing resin material part 6 is made to be an upper surface. A box body 7, which is formed as a unitary body by said side surface and the upper surface, is deposited on an area to be sealed. Then, heating is performed, and the sealing resin material is fused and deposited on a semiconductor-part mounting surface. Thereafter the resin is hardened. Thus the sealing resin material does not flows out of the flow-out preventing frame part 5, and the sealed state is very excellent. Therefore, the sealing processes can be simplified.</p> |
