| 摘要 |
To achieve a low permittivity and improve the long-term heat resistance of radiation-sensitive synthetic resin resists, a photopolymer system consisting of an epoxy resin esterified with furylacrylic acid and containing phenoxy and epoxy terminal groups is used as a coating (2, 13, 4) to produce printed circuits, particularly those of multi-layer structure. The curing is done with light in the wavelength range from 150 to 400 nm in the presence of a sensitiser without subsequent hot curing. Because of its good solubility, the product can readily be processed and it does not require any intermediate layers in a multilayer structure. Another field of application is in the production of negative photoresists for integrated VLSI semiconductor circuits. …<IMAGE>… |
