| 摘要 |
A component placement head for positioning micro-electronic components on a printed circuit board including an adjustable shelf for receiving the component from a stationary conveyor and accurately positioning the component below the placement nozzle on the head. The nozzle picks up the component from the shelf and aligns the component leads with the conductive lands on the board and then places the component on the board. There is a control limiting the position of the adjustable shelf to assure the component is properly positioned in the nozzle of the placement head.
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