| 摘要 |
This invention relates to an arrangement in conjunction with a cooling element (3) forming part of a cooling system intended for cooling an array of electronic equipment by air circulation, with a cooling element placed above and/or beneath the array of electronic equipment, such that an air-flow (5) cooled by the element is able to sink down towards and around the array of equipment, preferably between two arrays of equipment, while an air-flow (6b sec ) heated by the array, or arrays, of electronic equipment during operation is able to rise, the arrangement being effective to increase the cooling effect of the cooling element of the warm air-flow (6b sec ). It is proposed herewith that the cooling element is provided internally with one or more tubes (20-25) and/or that one or more tubes (20-25) are placed adjacent the cooling element. One end of the tube is connected to a fan or other forced air-flow. The tube (20-25) is also provided with apertures along its periphery, so as to create conditions for a forced air-flow through the cooling element (3). |
