| 摘要 |
<p>PURPOSE:To realize a highly reliable semi-sealing technique capable of a desired solder geometry irrespective of the weight of a cap or substrate by a method wherein a cap and a substrate with semiconductor devices on are accommodated in a container filled with gas with its pressure properly under control, the solder is then caused to melt, and the gap between the two portions to be soldered for sealing is adjusted and sustained with the solder present between them during the cooling process. CONSTITUTION:In a container 6 wherein gas pressure is kept under control, a cap 1 and substrate 2 mounted with semiconductor devices 4 are accommodated. Solder 12, 13 are caused to melt. So that the solder 12, 13 may be present between the regions to be sealed of the substrate 2 and cap 1, either of the substrate 2 or cap 1 is held in a holding means 14 for the accomplishment of a relative movement, whereby the gap between the two regions is adjusted and sustained during a cooling process. For example, after a vacuum baking, temperature is elevated to and kept at approximately 230 deg.C, a sealing gas is supplied into the container 6 through a valve 9, the pressure inside the container 6 is elevated to and kept at approximately 3 times the normal atmosphere, for the initial melting of the solder between the portions to be sealed of the cap 1 and substrate 2. Next, a servo mechanism is operated to descend the holding means 14 holding the cap 1, for the meeting of the solder 12, 13. The gap G along the sealing interface is temporarily made smaller than prescribed, whereafter the gap is trimmed to a prescribed size required for the establishment of bonding.</p> |
