发明名称 RESIN COMPOSITION
摘要 PURPOSE:A resin composition useful as a packaging material, etc., having improved blacking resistance and slipperiness without damaging transparency and toughness, obtained by blending a polyolefin resin with an acid value of >=specific value with a polysiloxane compound. CONSTITUTION:(A) A polyolefinic resin such as ethylene-methyl methacrylate- maleic anhydride copolymer, maleic anhydride graft polyethylene, etc., having >=2.5, preferably 1-500, especially preferably 10-300 acid value is blended with (B) 0.01-10wt%, preferably 0.1-3wt% polysiloxane compound, preferably amino-modified polysiloxane having 3-300,000 CS, preferably 30-100,000 CS viscosity at 25 deg.C and, if necessary, various thermoplastic resins (low-density polyethylene, ethylene copolymer etc.), antioxidant, filler, etc.
申请公布号 JPS61276837(A) 申请公布日期 1986.12.06
申请号 JP19850118071 申请日期 1985.05.31
申请人 SHOWA DENKO KK 发明人 INASAWA SHINTARO
分类号 C08L23/00;C08L33/00;C08L33/02;C08L51/00;C08L51/02;C08L83/08;C08L87/00;C08L101/00 主分类号 C08L23/00
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