发明名称 MANUFACTURE OF SEMICONDUCTOR DEVICE AND RESIN MOLDING DEVICE USED THEREFOR
摘要 PURPOSE:To equalize resin filling state by disposing a core of a mold at the center, equalizing the distances to cavities, thereby equalizing times until resin is filled in the cavities and pressure is applied thereto. CONSTITUTION:The lead frame 11 of a resin molding machine is composed of concentric inner and outer frames 12, 22, and islands 13 and leads 14 for surrounding the islands are disposed between the frames 12 and 22. Semiconductor elements are mounted on the islands of the frame 11, and electrodes are connected with leads 14. A core 16 filled with resin of the molding machine 15 is disposed at the center, and cavities 19 are communicated through gates 18 with radial liners 17 coupled with the core 16. The distances from the central core 16 to the cavities 19 are equalized, the times until the resin is cast in the cavities 19 and pressure is applied thereto are equalized to form uniform filling state of the resin.
申请公布号 JPS61276333(A) 申请公布日期 1986.12.06
申请号 JP19850116607 申请日期 1985.05.31
申请人 TOSHIBA CORP 发明人 TAKAHASHI KENJI
分类号 H01L21/56;B29C45/02;B29C45/14;B29C45/26;B29K101/10;B29L31/34 主分类号 H01L21/56
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