| 摘要 |
PURPOSE:To improve the trimming accuracy, by trimming a part of many semiconductor sensor chips for obtaining a deviation of an output voltage with respect to a designed value, and trimming the other chips while correcting output voltages based on the deviation. CONSTITUTION:A wafer 2 is proivided with a multiplicity of pressure sensor chips, among which the pressure sensor chips included in arrays S and K intersecting orthogonally with each other are subjected to first trimming under arbitrary conditions. Subsequently, only the array S for example is cut out from the wafer 2 and the sensor chips included therein the mounted on a predetermined package. A predetermined pressure is applied to the packaged pressure sensors to measure an output voltage thereof and a deviation of the output voltage is determined with respect to a designed value. A predetermined pressure is then applied to the array K to obtain its output voltage. Finally, the other pressure sensor chips are subjected to second trimming while they are probed to determine output voltages thereof such that they have an output voltage corresponding to a value obtained by correcting the previously obtained output voltage based on the deviation. According to this method, the chips can be trimmed efficiently and with high accuracy.
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