| 摘要 |
PURPOSE:To prevent a flaw from being made on the photo resist applied on the conveying surface of an Si wafer and to improve the yield of the semiconductor by a method wherein an exposure is performed on the Si wafer using an exposer provided with a prealignment station having its surface being formed into a mirror finish. CONSTITUTION:An Si wafer 9 finished in photo resist is fed coating out of a feeding side carrier 1 and is fed in a prealignment station 3 by feeding side conveying belts 2. Here the orientation flat 9a of the wafer 9 is detected, then the wafer 9 is put on an exposure wafer chuck 5 by an automatic hand 4, and after a photo mask matching and an exposure are performed, the wafer 9 is fed out on a housing side conveying plate 6. In this process, when the wafer 9 is fed in the station 3, a flaw can be prevented from being made on the photo resist applied on the conveying surface of the wafer because the surface of the station 3 is previously formed in a mirror finish.
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