| 摘要 |
PURPOSE:To obtain a semiconductor device without using wirings and a lead frame by burying a semiconductor chip in the same surface asa substrate, leading through conductors to an insulating film on the substrate, and sealing a part of the conductors with the chip. CONSTITUTION:The inner wall of a recess 11 of a ceramic or plastic substrate 10 is metallized, a semiconductor chip 12 is contained in the same plane fixedly, and coated with a CVD SiO2 film or a polyimide resin film 13. An electrode window 14 is opened to form aluminum leads 15. Then, the vicinity of the surface of a pellet 12 is coated in a trapozoidal shape with a sealing material 16, a magnetic layer 17 is formed on the back surface 10 of the substrate, and individually separated. A name and other information are recorded on the layer 17. With this construction a semiconductor device of high reliability can be contained inexpensively.
|
