| 摘要 |
PURPOSE:The titled composition which can be readily cured by irradiation with a small dose of light to give a cured product excellent in cracking resistance, electrical properties, moisture resistance and adhesiveness, obtained by mixing two photopolymerizable compounds with an epoxy resin, a reaction accelerator and a photopolymerization initiator. CONSTITUTION:100pts.wt. mixture obtained by mixing 5-80pts.wt. photo polymerizable compound (A) having at least one of each of photosensitive groups such as an epoxy group and a (meth)acrylic group in the molecule with 5-90pts. wt. photopolymerizable compound (B) having at least one of each of carboxyl and said photosensitive group in the molecule [e.g., mono(meth)acryloyloxyethyl hexahydrophthalate], 5-90pts.wt. epoxy resin (C) (e.g., bisphenol A epoxy resin) so that the ratio of the number of COOH groups to that of NCO groups is smaller than unity is mixed with 0.01-10pts.wt. reaction accelerator (D) (e.g., 2-methylimidazole) and 0.001-10pts.wt., per total of A+B, photopolymerization initiator (E), e.g., acetophenone (derivative).
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