| 摘要 |
PURPOSE:To improve alignment accuracy for fixing a semiconductor substrate to a support plate and alignment accuracy for assembling components by a method wherein the circumference of the semiconductor substrate and the support plate have identical dimensions and shapes with the substrate and the plate recessed parts and are mutually aligned automatically in a jig with protrusions to which the recessed parts are fitted. CONSTITUTION:A circular silicon substrate 1 and a circular molybdenum support plate 2 have identical dimensions and both of them have two recessed parts 3 and 4 which are placed at both ends of their diameter lines on their circumferences. The substrate 1 and the molybdenum plate 2 are put into a cylindrical fixing jig 5. The fixing jig 5 has an inner diameter slightly larger than the diameter of the substrate 1 and the support plate 2 and protrusions 6 which are fitted to the recessed parts 3 and 4 of the substrate 1 and the support plate 2. As the recessed parts 4 of the support plate 2 and the recessed parts 3 of the substrate 1 are coupled with the protrusions 6 in the jig 5, when the substrate 1 is fixed to the support plate 2 in the jig 5, the relation between their positions is not shifted by the circumferential rotation.
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