| 摘要 |
PURPOSE:To form solder bumps in different heights collectively by depositing solder in uniform thickness on an insulating film hardly wettable for soldering or on a metallic film having excellent wettability with solder and melting and collecting solder on the metallic film of the upper section of a connecting electrode section. CONSTITUTION:A substance such as SiO is used as an insulating film 3 hardly wettable for soldering 5, and metallic films formed by laminating and evaporating elements such as Pd in 1,000Angstrom and Au in 1,000Angstrom in this order are employed as metallic films 4 having excellent wettability with solder. Solder 5 is formed to the upper sections of the metallic films 4 and the insulating film 3. When flux is applied and solder 5 is melted through heating, solder depositing on one parts of the metallic films 4 is melted and diffuses to the whole surfaces of the metallic films 4, and solder on the insulating film 3 concentrates onto the metallic films 4. The height of a solider bump thus obtained can be determined to a desired value by previously adjusting the area ratio of the area of the metallic film 4 to the depositing area of solder 5. |
