发明名称 METALLIC MOLD FOR SEMICONDUCTOR RESIN SEALING
摘要 PURPOSE:To prevent any defect due to mold release stress by a method wherein, after mold releasing a formed part by thrusting it with main mold surface of metallic mold cavity successively using two ejectors, the molding coming into contact with a part of cavity is thrusted for mold releasing. CONSTITUTION:When a molding is ejected from a mold, the product is mold released from cavity sides firstly thrusted with the overall surface of main mold by the first electors 4, 6. At this time, the mold release stress concentration is prevented by mold releasing using the overall main surface from the cavity 3 sides. Next the molding coming into contact with a part of mold surfaces 3b, 3d only of metallic mold is mold released by the second ejectors 5, 7. Therefore the second ejectors 5, 7 are applicable regardless of shape and size thereof only if thrusting space can be secured.
申请公布号 JPS61272940(A) 申请公布日期 1986.12.03
申请号 JP19850114930 申请日期 1985.05.28
申请人 NEC CORP 发明人 UNO TAKAYUKI
分类号 B29C39/10;B29C33/44;B29C39/26;B29C39/36;B29C45/40;B29K105/20;B29L31/34;H01L21/56 主分类号 B29C39/10
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