| 摘要 |
A packaging member for microcircuits comprises a base element (1) having a projecting area (2) divided by intersecting slots (3) into teeth-like projections. A frame element (4) surrounds the base element (1) and defines a space in which a microcircuit can be housed with its substrate in contact with the teeth-like projections. The latter are made from a ductile material such as copper with high thermal conductivity. The nature of the base element enables the package to withstand thermal stress more easily. |
