TRIMMING METHOD FOR SEMICONDUCTOR DEVICE

摘要

PURPOSE:To improve yield by referring to an output from a temperature sensor unified with one part of a semiconductor wafer and trimming a semiconductor chip. CONSTITUTION:A probe card 9 supplies temperature sensor IC chips 5 and reference-temperature sensors 6 formed to a wafer 2 with a power supply from a measurement system 10 while transmitting or receiving signals among both the sensor IC chips 5 and the sensors 6 and the measurement system 10. The operation of the measurement of the measurement system 10 is controlled by a CPU11. The CPU11 drives a laser 12 and an XY movable mirror 13 according to a predetermined algorithm corresponding to the results of measurement acquired by the measurement system 10, and executes trimming operation by laser beams.