发明名称 Ungelled resins containing hydrolyzable moieties from organosilane compounds.
摘要 <p>Disclosed is an ungelled resin composition comprising a compound having at least one group containing a silicon atom selected from: &lt;Chemistry id="chema01" num="0001"&gt;&lt;Image id="ia01" he="18" wi="22" file="IMGA0001.TIF" imgContent="chem" imgFormat="TIFF" inline="no" /&gt;&lt;/Chemistry&gt;&lt;Chemistry id="chema02" num="0002"&gt;&lt;Image id="ia02" he="17" wi="31" file="IMGA0002.TIF" imgContent="chem" imgFormat="TIFF" inline="no" /&gt;&lt;/Chemistry&gt;&lt;Chemistry id="chema03" num="0003"&gt;&lt;Image id="ia03" he="18" wi="40" file="IMGA0003.TIF" imgContent="chem" imgFormat="TIFF" inline="no" /&gt;&lt;/Chemistry&gt;wherein &lt;UnorderedLists id="ula01" listStyle="none"&gt;&lt;ListItem&gt;Q represents the residue from an organic polyol selected from the group consisting of (1) simple diols, triols and higher hydric alcohols, (2) polyester polyols, (3) polyether polyols, (4) amide-containing polyols, (5) epoxy polyols and (6) polyhydric polyvinyl alcohols, and each&lt;/ListItem&gt;&lt;ListItem&gt;R independently is selected from the group of moieties consisting of hydrogen, and a C&lt;Sub&gt;1&lt;/Sub&gt;-C&lt;Sub&gt;10&lt;/Sub&gt; group joined to Si through an Si-C linkage, and&lt;/ListItem&gt;&lt;ListItem&gt;Y represents an easily hydrolyzable group.&lt;/ListItem&gt;&lt;/UnorderedLists&gt;</p><p>The ungelled resin composition contains an amount of easily hydrolyzable Y moieties directly bonded to silicon atoms such that the ratio of the number of grams of the ungelled resin composition to equivalents of easily hydrolyzable Y moieties in the ungelled resin composition is in a range of from 40 to 667. Preferred resin compositions of the invention can be cured in the presence of atmospheric moisture and a suitable catalyst at a temperature of less than or equal to 121 degrees Celsius within 3 hours.</p><p>Disclosed is a method for producing the ungelled resin composition.</p><p>Also disclosed is a nonaqueous composition, particularly a nonaqueous coating composition, containing an ungelled resin composition of the invention. Preferred coating compositions containing an ungelled resin composition of the invention can be cured in the presence of atmospheric moisture and a suitable catalyst at a temperature of less than or equal to 121 degrees C within 3 hours.</p>
申请公布号 EP0203391(A2) 申请公布日期 1986.12.03
申请号 EP19860105807 申请日期 1986.04.26
申请人 PPG INDUSTRIES, INC. 发明人 CHANG, WEN-HSUAN;MCKEOUGH, DAVID THOMAS
分类号 C08G59/00;C08F8/42;C08F16/00;C08F16/02;C08F16/06;C08G59/14;C08G63/00;C08G63/91;C08G65/48;C08G69/00;C08G69/48;C08G77/50;C08G85/00;C09D157/06;C09D183/00;C09D183/05;C09D201/02;(IPC1-7):C09D3/82;C08G77/42;C08G65/32 主分类号 C08G59/00
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