| 摘要 |
PURPOSE:To prevent the deformation of resist pattern during dry-etching process from happening by means of processing resist after exposure with aromatic base organic solvent. CONSTITUTION:A substrate is coated with resist which is to be prebaked. After exposure, if the substrate is immediately immersed in e.g. aromatic base organic solvent such as toluene etc., the surface layer of resist pattern part is solidified. Then the substrate is post-baked to be developed finally. If the resist is processed with aromatic base organic solvent, the resist is solidified and if the resist is processed with the same solvent after exposure, the resist pattern part is solidified. But if the resist is processed before exposure and development, only the surface layer of resist pattern top is solidified to prevent the deformation during the etching process from happening, while the sides of resist pattern are not solidified to facilitate the resist removal after etching process. |
