| 摘要 |
PURPOSE:To equalize the temperature at a cavity during the forming process by means of fixing heat insulating layers sealing gas to the sides of metallic molds coming into contact with atmosphere. CONSTITUTION:Heat insulating layers 7, 8 respectively fixed to the sides of metallic molds 1, 2 made of iron sheet around 1mm thick are formed into frame bodies 10-15mm thick sealing gas e.g. air. Through these procedures, multiple resin mold semiconductors can be formed of thermosetting resin meeting almost the same temperature requirements since the temperature difference between the sides of metallic molds 1, 2 and the part 10cm or less distant from the sides may be restricted to 1 deg.C or less. |
