发明名称 Baths for the electrolytic deposition of nickel-indium alloys on printed circuit boards
摘要 A novel plating bath for plating nickel/indium alloys, which bath contains one or more buffer/chelating agents such as citric acid and citrate salts, and alloys plated from such baths which have utility in electrical applications.
申请公布号 US4626324(A) 申请公布日期 1986.12.02
申请号 US19850714849 申请日期 1985.03.26
申请人 ALLIED CORPORATION 发明人 SAMUELS, GEORGE J.;GARMAN, JOSEPH M.
分类号 C25D3/56;H05K3/06;H05K3/24;(IPC1-7):C25D3/56 主分类号 C25D3/56
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