发明名称 PRODUCTION OF PREPREG FOR PRINTED CIRCUIT BOARD
摘要 PURPOSE:To obtain the titled prepreg having improved drillability, dielectric characteristics, etc., by using a varnish obtained by compounding a silicone- modified epoxy resin with a polyfunctional phenol, a cure accelerator, a fluororesin or a polyolefin and a coupling agent. CONSTITUTION:The objective prepreg can be produced by compounding (A) 100pts.(wt.) of an epoxy resin containing 1-100wt% silicone-modified epoxy resin produced by reacting (i) a bisphenol-A epoxy resin, (ii) tetrabromobisphenol A and (iii) a methoxy-containing silicone intermediate, e.g. the compound of formula (R is methyl, phenyl or methoxy; n is 0-3), with (B) 0.01-5pts. of a polyfunctional phenol, (C) 0.05-1pt. of a cure accelerator, preferably an imidazole compound having masked imino group, (D) 0.1-100pts. of a fluororesin or a polyolefin and (E) a coupling agent, preferably a silane coupling agent and impregnating and drying the resultant varnish in a substrate.
申请公布号 JPS61272244(A) 申请公布日期 1986.12.02
申请号 JP19850114932 申请日期 1985.05.28
申请人 HITACHI CHEM CO LTD 发明人 YUSA MASAMI;SHIBATA KATSUJI;MIYADERA YASUO
分类号 C08G59/00;C08G59/14;C08G59/30;C08G59/32;C08G59/62;C08J5/24;C08L1/00;C08L7/00;C08L21/00;C08L23/00;C08L27/00;C08L63/02;C08L101/00;H05K1/03 主分类号 C08G59/00
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