发明名称 LOADING FRAME HAVING MAGNET FOR SEMICONDUCTOR RESIN SEALING MOLD
摘要 PURPOSE:To make it possible to fix frames in a stable state, by mounting magnets at positions corresponding to base parts of lower pawls and upper pawls, which fix the frames at respective positions. CONSTITUTION:A main body 7 and an upper lid 8 of a loading frame are opened upward in the vertical direction with respect to the Figuer by a pair of hinges 2. A plurality of space parts (a), which are cut in the vertical direction with respect to the Figure, are provided in the longitudinal and the lateral lines in said main body and upper lid. A lower pawl 5 and an upper pawl 6, which are protruded in the direction of the space parts (a), are provided at the main body 7 and the upper lid 8. A frame 1 is held between the pawls. Magnets 10 are mounted at positions corresponding to the vicinities of the base parts of the lower pawls 5 and the upper pawls 6. In the loading frame described above, the effect of the warping of the main body 7 and the upper lid 8 is removed by the pushing force of the magnets 10. The swaying of the frame 1 is removed, and the stable attitude is obtained.
申请公布号 JPS61271846(A) 申请公布日期 1986.12.02
申请号 JP19850113305 申请日期 1985.05.28
申请人 MITSUBISHI ELECTRIC CORP 发明人 HARA HIDEO
分类号 H01L21/56;(IPC1-7):H01L21/56 主分类号 H01L21/56
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