发明名称 Selective bonding interconnection mask
摘要 An interconnection mask which is sandwiched between two members to be bonded together is comprised of a thin sheet of preselected material which has a plurality of apertures therein which are positioned, sized, and shaped to define the common bonding areas between the two members whereby structural failures induced by bonding and loading characteristics of the two members are minimized. A method for making an apparatus which utilizes the interconnection mask comprises the steps of preparing a mask of preselected material having a plurality of apertures therein, each aperture being positioned, sized and shaped to define a common bonding area between first and second members of the apparatus whereby the structural failures induced by the bonding and loading characteristics of the two members are minimized; placing a layer of bonding material on a surface of the first member; placing the interconnection mask over the layer of bonding material; placing the second member over the mask; bonding the first and second members together at each common bonding area defined by the apertures in the mask.
申请公布号 US4626309(A) 申请公布日期 1986.12.02
申请号 US19840627127 申请日期 1984.07.02
申请人 MOTOROLA, INC. 发明人 MULLEN, III, WILLIAM B.;GROTELUESCHEN, JAMES H.;HENSCHEL, ROBERT
分类号 C09J5/00;H05K1/02;H05K1/03;H05K3/00;H05K3/28;H05K3/32;(IPC1-7):B32B31/04;B32B31/12 主分类号 C09J5/00
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