发明名称 Plasma etching system for minimizing stray electrical discharges
摘要 A plasma etching system includes a grounded reactor chamber having ungrounded chuck and counter electrodes therein. Circuitry is provided so that the potentials applied to the electrodes are about half those normally applied in single ended systems so that stray electrical discharges from the electrodes to the reactor chamber and other parts in the system are minimized.
申请公布号 US4626312(A) 申请公布日期 1986.12.02
申请号 US19850748291 申请日期 1985.06.24
申请人 THE PERKIN-ELMER CORPORATION 发明人 TRACY, DAVID H.
分类号 C23F4/00;H01J37/32;H01L21/302;H01L21/3065;(IPC1-7):B44C1/22;C03C15/00;C03C25/06;C23F1/02 主分类号 C23F4/00
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