发明名称 THERMOPLASTIC RESIN COMPOSITION
摘要 PURPOSE:To provide a composition obtained by compounding a specific modified thermoplastic resin composition with a hydroxyl-containing vinyl polymer, containing the whole components in a state mixed with each other in high compatibility and giving a molded article having excellent impact resistance and dimensional stability. CONSTITUTION:The objective composition can be produced by compounding (A) 5-95wt% modified thermoplastic resin composition obtained by reacting a mixture of a polyolefin and a vinyl polymer with an unsaturated carboxylic acid or its anhydride with (B) 95-5wt% vinyl polymer having hydroxyl group. The component A is a polymer having an average molecular weight of 3,000-1,000,000, preferably 5,000-500,000 and grafted with 1-100, preferably 1-50 carboxyl groups or their anhydride groups per 1mol. The component B is e.g. a styrene-hydroxyethyl acrylate copolymer having a molecular weight of 1,000-1,000,000, preferably 2,000-500,000.
申请公布号 JPS61272256(A) 申请公布日期 1986.12.02
申请号 JP19850114596 申请日期 1985.05.28
申请人 SHOWA DENKO KK 发明人 SASAKI YASUAKI
分类号 C08L23/00;C08L23/26;C08L25/00;C08L25/04;C08L25/08;C08L33/00;C08L33/02;C08L51/00;C08L51/02;C08L101/00 主分类号 C08L23/00
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