发明名称 THIN FILM FORMING DEVICE
摘要 PURPOSE:To prevent the corrosion of a tantalum sheet even when a vapor deposition substance is Au by arranging the tantalum sheet on the surface of a molybdenum sheet on the substrate side in an electron drawing-out grid fixed to the molybdenum sheet arranged between a crucible and the substrate through the tantalum sheet. CONSTITUTION:The thin film forming device has a crucible arranged in a vacuum region and used for injecting the vapor of a vapor deposition substance such as Au, a substrate on which the injected Au vapor is deposited and an electron drawing-out grid 5 which is arranged between the crucible and the substrate and fixed to a molybdenum sheet 11 through a tungsten sheet 10. The tantalum sheet 10 is arranged on the surface of the molybdenum sheet 11 on the substrate side. Accordingly, the tantalum sheet 10 is not brought into direct contact with Au vapor and is not corroded by the Au vapor.
申请公布号 JPS61272370(A) 申请公布日期 1986.12.02
申请号 JP19850114645 申请日期 1985.05.28
申请人 MITSUBISHI ELECTRIC CORP 发明人 HANAI MASAHIRO;KUZE YASUMI
分类号 C23C14/32 主分类号 C23C14/32
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