发明名称 SLURRY FOR LAPPING
摘要 PURPOSE:To provide a slurry for lapping which has a high processing speed and a long service life, prepd. by adding silica particles which are sensitive to the sedimentation rate of abrasive grain to an abrasive grain-contg. slurry. CONSTITUTION:Silica particles which are sensitive to the sedimentation rate of abrasive grain are added to a slurry which contains abrasive grains and processing solution. The slurry is used for lapping in which the slurry is placed between workpiece and working tool which are making relative movement under pressure. The silica particle should pref. have an average diameter of about 12mu and it is used in an amount of 0.2-2pts.wt. per 100pts.wt. processing solution.
申请公布号 JPS61271376(A) 申请公布日期 1986.12.01
申请号 JP19850112114 申请日期 1985.05.27
申请人 TOSHIBA CORP 发明人 OKADO SHIGEO;KAWAGUCHI KATSUJI
分类号 B24B37/00;C09K3/14 主分类号 B24B37/00
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