| 摘要 |
Apparatus for encapsulating a plurality of electronic components which are bonded to the conductors of a strip, comprising a mould (1,2) an injection unit with a plurality of plungers (13) each cooperating with a mould cavity sprue (4,5) and controlled by a hydraulic cylinder (15) each plunger (13) being slidable in a carrier (9) which itself is adapted to move towards and away from the side of the mould with a controlled speed, each plunger (13) having a heating element (14) and constant pressure means (15,16) and each plunger carries a signal means (19,20), all signal means being connected to a circuit of the driving mechanism of the carrier (9). |
