| 摘要 |
<p>Method for the production of printed-circuit boards with more than four conductive layers by the non-detachable connection of individual laminates (2) and adhesive prepregs (3) by means of pins, hollow rivets (7), brackets and/or adhesive film pieces arranged in the region of positioning holes (5) to form individual circuit packets (1) which are arranged packet-by-packet between large-format adhesive prepregs (3) and copper foils (4) and are pressed together. <IMAGE></p> |
