发明名称 FORGING DIE PACKAGE
摘要 A die package for forming a central disc structure having a plurality of integrally formed appendages extending therefrom includes a cylindrical array of appendage forming, abutting die segments which are prevented from tilting or moving in a circumferential direction by means of pins extending into slots formed along the parting lines between abutting die segments in the upper surfaces of the segments. In one embodiment, the pins extend upwardly from between opposed, parallel, radially and axially extending walls of each slot and fit tightly between said walls. The upper ends of the pins are secured to a rigid annular ring overlying the slots. The slots extend radially inwardly of the pins to allow the die segments to be moved radially outwardly after forging to release the forging from the die package.
申请公布号 IL71926(A) 申请公布日期 1986.11.30
申请号 IL19840071926 申请日期 1984.05.25
申请人 UNITED TECHNOLOGIES CORPORATION 发明人
分类号 B21J5/02;B21J13/02;B21K1/36;B21K3/02;(IPC1-7):B23D31/00;B21K1/32;B21J3/00 主分类号 B21J5/02
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