| 摘要 |
PURPOSE:To eliminate improper positioning and shorting between wires in a display device by forming a photoresist on the entire substrate excluding a die pad of an LED carrying substrate, coating thermosetting conductive adhesive thereon, and matching the pellets. CONSTITUTION:A metallic wiring layer 32 is formed on a ceramic substrate 31, and an insulating layer 33 is formed on the surface of the substrate excluding the die pad portion for carrying the LED pellet. Then, a desired pattern metallic wiring layer 34 and a dry film 39 are formed thereon. Thereafter, electroconductive thermosetting adhesive is dropped to the die pad portion opened with a dry film 39 to drop the LED pellets 36a, 36b through the openings of the dry film 39 as aids to match the positions, heat treated, and cleaned on the surface of the substrate. Finally, anode electrodes 37a, 37b and metallic wiring layer 34 are bonded onto the LED pellet with Au wire 38. |
